【中信建投：关注国内半导体材料企业加速进口替代的认证节奏以及投资机会】中信建投研报指出，当前AI通胀来到了材料端，而材料环节的标的更加分散，而且多数强势公司在日本，2025年下半年以来双边关系的紧张更有加速迹象。供给端进口替代，需求端AI通胀成为几乎完美的组合。我们判断，对日本进口替代主题会有更多演绎空间，继续关注半导体材料进口替代交易，关注国内半导体材料企业加速进口替代的认证节奏以及投资机会。
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.