中信建投研报指出,对照全球先进封装工艺的发展路径,中国大陆的先进封装工艺目前正处于CoWoS技术渗透率快速提升的阶段。由

智通财经
Aug 18
中信建投研报指出,对照全球先进封装工艺的发展路径,中国大陆的先进封装工艺目前正处于CoWoS技术渗透率快速提升的阶段。由于中国大陆的晶圆代工厂暂未进行RDL等中段工艺量产,而OSAT厂商在2.5D/3D/CoWoS领域均有所布局。我们认为,能够率先突破量产且完成产能扩张的OSAT厂商有望形成先发优势,卡位占据较高的行业份额。但伴随产业发展趋势演进,我们认为类比台积电,中国大陆的晶圆代工厂在先进封装领域的重要性同样不可忽视,Foundry在前道技术和设备产能的优势能够有助于其在先进封装技术迭代中实现追赶甚至反超。

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