【AI高算力新型基材技术路线专题研讨会在京召开】据中国电子信息产业发展研究院消息，8月14日下午，由赛迪研究院人工智能场景创新与智能芯片测评工业和信息化部重点实验室和人工智能产业工委会共同举办的“AI高算力新型基材技术路线专题研讨会”在北京赛迪大厦召开。会议聚焦AI算力爆发式增长背景下新型基材技术路线的工程可行性与产业化前景，邀请来自材料研发、设备制造、封装工艺、芯片设计、智算服务器等领域的企业专家共同研判技术趋势、探讨产业协同路径。与会专家一致认为，当前新型基材处于产业化窗口期，主要瓶颈是“材料—设备—工艺—终端”协同不足、标准缺失和中试平台缺位，关键材料、专用设备、先进封装等环节可能因供需错配和供应链集中形成新卡点；可靠性数据与统一测试标准的缺乏，同时造成“材料企业不敢投入、终端企业不敢采用”。专家建议加强产能监测预警，推动多元化供应和技术备胎，建立跨领域联合攻关机制，建设示范应用先导区，以场景牵引加速国产化替代，打通从实验室到产线、从材料到终端的产业闭环。
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