存储芯片产能已谈到2030年!DRAM涨势热

格隆汇
Aug 20
据台湾工商时报,在AI带动存储芯片及先进封装需求长期成长下,华邦电(2344.TW)提前启动高雄路竹厂扩产规划,将原定二、三期整并为Module B同步开发,预计2027年动工兴建无尘室,最快2029年初开始装机。依目前规划,Module B预计2027年动工,最快2029年开始装机,并依客户需求预测(Forecast)及LTA分阶段导入设备。目前已有客户提前洽谈2029年、2030年产能。 机构指出,华邦电第三季利基型DRAM与SLC NAND,均呈现供不应求,价格季涨幅估约50%;NOR Flash则受惠云端服务供应商(CSP)大客户积极备货,排挤其他应用供给,价格季涨幅估约30%。第四季存储芯片价格涨幅虽预计收敛至2~5%,但受惠DRAM产能增加及出货量成长,机构预计,华邦电营收及获利仍可维持季增走势。

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