安世中国CEO张秋明:过去11个月已交付超400亿颗芯片

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【安世中国CEO张秋明:过去11个月已交付超400亿颗芯片】8月23日晚间消息,在安世中国新品全球发布会上,安世中国首席执行官张秋明发表演讲。张秋明透露,过去11个月以来,安世中国已经向全球上千家客户交付超过400亿颗芯片。张秋明表示,作为全球功率半导体龙头之一,我们的核心业务和持续创新让安世的产品组合在工艺和性能效率上被公认为行业标杆,但百年老店也意味着我们要直面历史的包袱。当全球供应链的变局如海啸般袭来,当技术封锁的阴霾笼罩,安世中国没有选择退缩,更没有选择被动等待,我们选择了一条最艰难的路,主动重建。

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