小米自研大模型专用AI加速芯片玄戒O100亮相:支持1.22TB/s超高带宽,端侧推理速度最高可达330TPS

新浪科技
Aug 24

  新浪科技讯 8月24日下午消息,在今日小米玄戒技术沟通会上,小米集团副总裁、新业务部总裁朱丹发表演讲。

  沟通会上,玄戒O100亮相,为小米首颗专为端侧大模型而生的高带宽AI加速芯片。行业首款6nm晶圆级垂直堆叠先进封装,采用Hybrid Bonding混合键合工艺,实现业界领先的1.4微米键合间距。1.22TB/s超高带宽,16倍于传统旗舰手机,端侧推理速度最高可达330TPS。

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