据知情人士透露,博通(AVGO.US)正与一批贷款机构洽谈,计划为一项AI芯片融资交易筹集超过600亿美元债务资金,该交

智通财经
Aug 21
据知情人士透露,博通(AVGO.US)正与一批贷款机构洽谈,计划为一项AI芯片融资交易筹集超过600亿美元债务资金,该交易将惠及Anthropic等企业。知情人士表示,这项融资方案仍在敲定过程中,可能还会包含规模约300亿美元的次级债部分。其中几位知情人士称,根据拟议方案,博通将为部分优先担保债务提供担保,该部分融资规模可能在600亿至700亿美元之间。若按目前讨论中的规模计算,整个融资计划总额最高可能达到1000亿美元。这项协议将进一步推动围绕人工智能基础设施建设的融资热潮。包括Claude开发商Anthropic在内的AI企业正越来越深度参与基础设施建设,希望确保自身拥有充足的计算能力。与此同时,博通也在寻求扩大芯片及其他数据中心设备销售,在这一利润丰厚的市场中向英伟达发起挑战。

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