小米(01810.HK) 为终端产品推出AI芯片“玄戒O3”,《路透》引述消息人士报道,该芯片将由台积电(TSM.US) 采用3纳米制程技术生产,预计将用于小米即将推出的旗舰折机,出货量目标为20万至30万部。小米表示,已委托台积电制造“玄戒O100”以及“玄戒D100”,目前“玄戒O3”已进入量产阶段,而“玄戒O100”及“玄戒D100”已完成开发,预计将于明年应用。(mn/u)(港股报价延迟...
Source Link小米(01810.HK) 为终端产品推出AI芯片“玄戒O3”,《路透》引述消息人士报道,该芯片将由台积电(TSM.US) 采用3纳米制程技术生产,预计将用于小米即将推出的旗舰折机,出货量目标为20万至30万部。小米表示,已委托台积电制造“玄戒O100”以及“玄戒D100”,目前“玄戒O3”已进入量产阶段,而“玄戒O100”及“玄戒D100”已完成开发,预计将于明年应用。(mn/u)(港股报价延迟...
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