【中钨高新：子公司拟投1.9亿元实施AI高速高频PCB用高精密微型刀具技改扩能项目】中钨高新公告称，公司控股子公司金洲公司拟实施AI高速高频印制电路板用高精密微型刀具产能1.4亿支/年建设项目，预计总投资1.9亿元，资金来源为自有资金1.785亿元及银行借款0.115亿元。项目将在深圳基地东区以租赁厂房方式实施，建设期一年，第二年达产。经测算，项目投资财务内部收益率为14.55%。本次投资不涉及关联交易，不构成重大资产重组，无需提交股东会审议。
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