ChainCatcher 消息，高盛 8 月 23 日研报指出，将 2026 至 2028 年晶圆前端设备（WFE）预测上调至 1500 亿、2180 亿和 2810 亿美元，较此前预测分别高出 6%、17% 和 35%。调整后三年同比增速为 36%、45% 和 29%，此前预期为 28%、32% 和 12%。
高盛认为，DRAM 和先进制程代工是短期主要驱动力。DRAM 领域，三星和 SK 海力士资本开支预测分别上调 22% 和 19%，HBM4 量产拉动刻蚀、沉积等设备需求；代工领域，台积电每年资本开支上修 80 亿美元，N2 制程进入量产爬坡阶段。NAND 和逻辑/其他（含 Terafab）将在中期接力，SpaceX 与特斯拉承诺的约 168 亿美元 Terafab 初始阶段设备投入已纳入 WFE 预测。
高盛看多全球半导体设备股，重点推荐应用材料、泛林半导体、ASML、东京电子、ASMI、BESI、Lasertec 和荏原。
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