中信证券:预计全球TIM市场规模将由2025年的96.7亿元增至2030年的221.2亿元

智通财经
Aug 22
【中信证券:预计全球TIM市场规模将由2025年的96.7亿元增至2030年的221.2亿元】据中信证券,AI算力需求增长与先进封装演进持续推升芯片功耗和热流密度,推动TIM向高导热、低热阻和高可靠性升级。AI服务器与新能源汽车将成为主要增量来源,预计全球TIM市场规模将由2025年的96.7亿元增至2030年的221.2亿元。海外厂商凭借配方积累、量产经验和客户认证占据中高端市场,国内企业正依托本土芯片、封测及终端产业链加快产品导入。建议把握两条投资主线:1)芯片级TIM国产突破;2)电子级有机硅材料升级及热管理应用拓展。

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