SK海力士新一代HBM引入先进封装技术

格隆汇
6 hours ago

据市场消息,SK海力士正在为其下一代HBM解决方案引入包括英特尔EMIB在内的先进封装技术,并计划最终迈入3D封装时代。

在2026年的Hot Chips大会上,SK海力士封装工程副总裁Jaesik Lee发表了题为“高带宽内存的先进封装”的报告,详细阐述了公司将如何利用先进封装技术加速其HBM产品路线图。

目前SK海力士正在探索混合键合(Hybrid Bonding)等方法,以突破16层堆叠的限制。

未来,SK海力士还计划通过增加TSV数量、提高逻辑工艺集成的IO速度,以及优化电源分配网络(PDN)来解决功耗挑战。

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