市场研究机构Counterpoint Research周五发布的报告显示，今年第二季度全球纯晶圆代工半导体市场规模同比增长29%，主要得益于人工智能（AI）芯片需求的大幅增长。
Counterpoint Research在报告中指出，AI相关订单以及产能重新调配，仍是先进制程与成熟制程出现供需失衡的主要驱动因素。
台积电在第二季度继续保持市场领先地位，市场份额达73%，连续两个季度位居第一。
Counterpoint Research认为，台积电的强劲表现主要得益于其2纳米工艺芯片的大规模量产、3 纳米产能扩充，以及成熟 8 英寸、12 英寸工艺和先进封装出现供给短缺。
三星电子保持第二位，其市场份额与上一季度相比基本持平。
三星晶圆厂的主要目标仍是提升SF2的良率。然而，除了上半年晶圆价格上升外，SF4和SF5的需求也是推动收入增长的关键因素。
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.