金吾财讯 | 广发证券研究指，需求端AI算力与先进封装已将球硅推入刚需主材层级，供给端认证周期长、化学法扩产慢，高端球硅存在供需缺口，产品有望迎来量价齐升，目前逐步实现国产替代。风险提示：行业周期性波动、市场竞争加剧、技术创新不及预期。
金吾财讯 | 广发证券研究指，需求端AI算力与先进封装已将球硅推入刚需主材层级，供给端认证周期长、化学法扩产慢，高端球硅存在供需缺口，产品有望迎来量价齐升，目前逐步实现国产替代。风险提示：行业周期性波动、市场竞争加剧、技术创新不及预期。
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