ChainCatcher 消息，苹果首款 2 纳米 M6 芯片正式亮相，配备 12 核心 CPU、12 核心 GPU 及双 16 核心神经网络引擎，统一内存带宽最高达每秒 170GB，首波搭载于新款 Mac mini。该芯片由台积电 2 纳米制程打造，首度采用环绕栅极（GAA）纳米片晶体管，为全球最先亮相的消费级 2 纳米芯片。
供应链关注后续高阶 M 系列封装架构。从前代 M5 Pro、M5 Max 的 Fusion Architecture 及 M5 Ultra 四晶粒设计推演，苹果芯片已由单一大型裸晶走向模块化。未来 M6 Pro、Max 或 Ultra 有望提升 SoIC-MH、WMCM 等先进封装需求，以 SoIC-MH 提高互连密度，WMCM 整合逻辑、LPDDR 内存及高速 I/O。
台积电积极备战扩产，竹南 AP6 为 SoIC 主力量产基地，龙潭 AP3 升级 WMCM，嘉义 AP7 承接相关产能。法人预估 WMCM 月产能至 2026 年底约 6 万片，2027 年逾 12 万片。设备厂弘塑、均华、印能及材料厂长兴、新应材、永光等有望受惠。
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