英伟达35亿美元投资联发科可转债 双方共建AI软硬件生态

智通财经
Aug 31
【英伟达35亿美元投资联发科可转债 双方共建AI软硬件生态】英伟达公司将向联发科投资35亿美元,以此深化与其的合作。当前英伟达正努力说服更多企业开发芯片,适配其占据主导地位的数据中心生态。两家企业周一发布联合声明表示,英伟达将购买可转换为联发科股份的债券。这笔投资拓展了两家芯片设计商的合作关系。联发科将采用NVLink Fusion以及新发布的NVHBM技术,作为英伟达技术套件的一部分,助力数据中心内部组件实现更顺畅的互联。联发科正助力数据中心运营商自研硬件组件,以此向博通、美满电子发起竞争。对英伟达而言,这份新协议是其最新举措,旨在确保人工智能未来的发展围绕自家硬件平台与技术标准展开。该公司一直在打造NVLink Fusion这类数据中心互联系统,并与联发科这类企业开展合作,以此巩固其在整条硬件产业链中的核心地位,而不只是依靠性能领先的AI加速芯片。在与联发科达成本次合作之前,亚马逊已发布类似公告,计划再部署200万颗英伟达芯片。关键在于,亚马逊同时承诺,将在自家自研芯片上采用英伟达的互联技术。

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