台积电:硅光成光收发器主流 明年市占率有望超过50%

格隆汇
Aug 31
台积电先进封装技术发展副总经理徐国晋今天表示,光收发器底层架构正经历结构性转变,硅光子已成为主流型态,预计2027年市占率有望超过50%,而硅光子最终体现是共封装光学(CPO),今年下半年将有厂商投入量产。

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