中国长鑫存储在先进存储芯片领域取得突破

路透中文
Sep 01
中国长鑫存储在先进存储芯片领域取得突破--Information

路透8月31日 - 据《Information》周一报道,中国内存芯片制造商长鑫存储 688825.SS 已开始小批量生产先进的高带宽内存。

  • 报道援引两位知情人士的话称,长鑫存储正在生产HBM3E,这是一种用于人工智能芯片组的高端高带宽内存。

  • 报道称,该公司计划于2027年扩大产能。

  • 报道称,包括阿里巴巴集团旗下的平头哥半导体有限公司和总部位于北京的寒武纪在内的多家中国芯片设计公司,正在将其处理器与该内存进行测试。

  • 报道称,如果一切按计划进行,这些公司最早将于明年在产品中采用长鑫存储的内存。

  • 长鑫存储、寒武纪和阿里巴巴旗下的平头哥半导体有限公司暂未对此置评。

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