小米18 Fold亮相IFA:搭载自研玄戒O3芯片,将于9月7日正式发布

智通财经
Sep 03
【小米18 Fold亮相IFA:搭载自研玄戒O3芯片,将于9月7日正式发布】IFA 2026开幕前夕,小米举行全球发布会,小米集团合伙人、总裁、手机部总裁卢伟冰手持小米首款中折叠旗舰手机小米18 Fold真机亮相,这也是这款即将发布的新品全球首秀。据悉,小米18 Fold配备5.38英寸外屏,展开后为7.58英寸内屏。该产品是小米首款搭载新一代玄戒O3芯片的旗舰手机,还搭载小米澎湃OS 4以及小米MiMo端侧大模型,同时首发长鑫LPDDR6内存,将于9月7日正式发布。

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