台积电季度芯片制造设备需求今年几乎翻倍

格隆汇
Sep 02
台积电(TSM.US)联席首席运营官侯永清今日表示,随着公司扩大产能以满足人工智能需求,其对芯片制造设备的需求较去年年底以来几乎翻了一倍。侯永清称,公司已将季度设备采购预估提高至去年12月预测水平的约1.9倍。这是人工智能开发商需求旺盛以及全球数据中心大规模扩建进一步推高芯片需求的最新迹象。台积电目前还面临缺乏有经验建筑工人的问题,公司正试图在中国台湾地区及海外建设并配备约20座工厂,其扩张力度在公司历史上前所未有。过去,台积电通常同时推进4至5座新厂房的建设。侯永清表示:“目前几乎是在以过去4到5倍的速度追赶,但依然无法满足需求。”

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