台积电将微通道散热技术纳入研发蓝图

格隆汇
Sep 02
台积电先进封装研发处长陈燕铭表示,微通道(Microchannel)散热技术通过在芯片或封装结构内设置微型流体通道,让冷却液更接近热源,有助提高热传效率,台积电已开始导入相关技术,并计划与封装架构共同开发。陈燕铭还称,台积电可整合24颗HBM、面积大于14倍光罩尺寸的CoWoS版本预计2029年实现。从2024年至2029年,单一CoWoS封装可整合的AI运算晶体管数量将增长逾48倍,HBM带宽规模则增加34倍,凸显散热技术必须同步升级。

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