9月7日长鑫科技召开2026年半年度业绩说明会。此前市场传言苹果已在测试长鑫科技的芯片。长鑫科技总经理赵纶回应称,公司以

智通财经
Sep 07
9月7日长鑫科技召开2026年半年度业绩说明会。此前市场传言苹果已在测试长鑫科技的芯片。长鑫科技总经理赵纶回应称,公司以开放的态度与全球优质客户探讨合作机会,公司产品在性能、质量和供应稳定性方面已具备与国际主流厂商竞争的能力。至于HBM(高带宽内存)领域的进展,赵纶表示,公司将按照既定的技术路线图和商业计划保持产品与制程工艺的持续迭代。赵纶表示,服务器市场需求旺盛,上半年公司持续在该领域拓展业务,在下游需求提升等因素推动下,公司应用于服务器领域的产品贡献增加。关于国产光刻机DUV导入验证情况,长鑫科技称,公司围绕供应链建设采取了一系列措施,重点聚焦国产供应链的开发与验证,带动半导体设备等产业链核心环节协同发展。(一财)。

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