本川智能:拟投资20亿元建设年产150万平方米AI算力高多层、高阶HDI电路板产业化新建项目

每日经济新闻
Sep 08

每经AI快讯,9月8日,本川智能(300964.SZ)公告称,公司拟与南京溧水经济开发区管理委员会签订投资建设协议,投资建设年产150万平方米AI算力高多层、高阶HDI电路板产业化新建项目,计划总投资约20亿元,资金来源为自有及自筹资金。项目达产后预计年产值达20亿元,年税收不低于6000万元。该事项尚需提交股东会审议。

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