ChainCatcher 消息，中国封测龙头长电科技于 9 月 7 日宣布，计划通过非公开发行股票募集不超过 65 亿元人民币（约合 9.68 亿美元），用于 AI 芯片先进封装产能扩张及相关技术研发。
本次募资将主要投向高密度系统级封装、晶圆级封装等面向 AI 计算芯片的产线建设，以应对来自英伟达、AMD 等客户的订单需求。长电科技表示，AI 芯片对封装技术的带宽和散热要求显著提升，现有产能已接近满负荷运转。目前该募资方案尚需获得股东大会及监管机构批准。
ChainCatcher 消息，中国封测龙头长电科技于 9 月 7 日宣布，计划通过非公开发行股票募集不超过 65 亿元人民币（约合 9.68 亿美元），用于 AI 芯片先进封装产能扩张及相关技术研发。
本次募资将主要投向高密度系统级封装、晶圆级封装等面向 AI 计算芯片的产线建设，以应对来自英伟达、AMD 等客户的订单需求。长电科技表示，AI 芯片对封装技术的带宽和散热要求显著提升，现有产能已接近满负荷运转。目前该募资方案尚需获得股东大会及监管机构批准。
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