阿斯麦(ASML)表示,计划与其主要客户合作,开发能够生产最先进芯片制造设备的新方案,以满足英伟达等公司设计的大型数据中

智通财经
Sep 08
阿斯麦(ASML)表示,计划与其主要客户合作,开发能够生产最先进芯片制造设备的新方案,以满足英伟达等公司设计的大型数据中心芯片需求。目前ASML生产的被广泛应用的极紫外(EUV)光刻机可制造面积最大约800平方毫米的芯片,ASML即将推出的下一代“高数值孔径”EUV光刻机,能够制造出更为精细的芯片。不过,由于其采用尺寸较小的掩模版,目前在可制造芯片面积方面受到限制。ASML计划到2031年展示采用更大尺寸掩模版的试验生产线,并在2033年使这项新技术具备大规模量产能力。

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10