大摩:AI 芯片封装需求强劲至 2028 年

链捕手
Sep 11

ChainCatcher 消息,摩根士丹利表示,尽管市场预期数据中心投资将放缓,但由于先进芯片封装需求保持强劲,AI 半导体供应商的增长到 2028 年可能持续超过更广泛的云支出增长。

预计 2028 年先进封装总产能将增长约 50%,而云服务提供商的资本支出增幅为 12%。

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