机构:2Q26晶圆代工营收接近534.9亿美元,先进制程与AI需求持续强劲

智通财经
Sep 09
【机构:2Q26晶圆代工营收接近534.9亿美元,先进制程与AI需求持续强劲】根据TrendForce集邦咨询最新晶圆代工产业研究,2026年第二季全球前十大晶圆代工厂合计产值季增11.5%,已接近534.9亿美元,再创新高。成长动能除了AI HPC主芯片等先进制程持续供不应求,PMIC/Power Discrete等AI周边IC需求同步增长,加上电视、PC/笔记本等消费性供应链提前备货效应延续,带动部分成熟制程产能转趋吃紧。观察第三季营收表现,消费性IC设计客户考量成熟制程产能可能持续受排挤,且预估晶圆价格上涨,仍维持一定投片动能。此外,智能手机旗舰机种进入备货周期,以及AI HPC往新平台转进放量,皆有助于整体晶圆代工产值进一步提升。

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