地平线征程芯片量产突破1500万颗 牵手一汽大众加速智驾平权落地

证券日报
Sep 16

9月15日,地平线举办“地平线智驾芯片量产突破1500万见证仪式”。活动现场宣布,品牌第1500万颗征程芯片将搭载于一汽-大众全新车型ID.AURA T6,全场景辅助驾驶系统HSD V2.1版本也即将推出,新增全场景倒车功能。  高工智能汽车研究院数据显示,2026年上半年地平线在自主品牌ADAS(高级驾驶辅助系统)芯片市场份额突破50%,城区NOA芯片市场份额达22.8%;征程系列芯片累计装车...

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