金吾财讯 | 台积电（TSM）美股盘前股价小幅走高，暂报419.49美元，涨幅0.35%。消息面上，市场媒体新近报道称，联发科已正式推出其采用台积电2纳米工艺的移动芯片Dimensity 9600 Pro。联发科表示，天玑9600 Pro（Dimensity 9600 Pro）是其首款采用台积电2纳米制程的移动处理器，同期推出的天玑9600M（Dimensity 9600 M）则采用台积电3纳米制程，面向更广泛的旗舰手机市场。搭载这两款芯片的智能手机即将上市。此外，近日台媒方面亦披露，台积电计划在2028年将其芯片封装（CoWoS）产能从2026年的水平翻一番。而台积电的CoWoS是人工智能GPU的领先封装技术，目前已被英伟达（NVDA）等行业巨头广泛采用。
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