ChainCatcher 消息,三星电机与高通正在共同开发用于 2.1D 封装的有机桥技术,相关开发与验证已进行一年以上。有机桥类似英特尔 EMIB 所用硅桥,但采用有机材料并以基板工艺制作,用于连接同一封装内的多颗半导体芯片。
三星电机在带凹槽的 FC-BGA 基板中埋入有机桥,连接高通芯片并评估性能与可靠性。高通正考虑将其用于数据中心大型多芯片半导体,并于 2024 年 10 月申请相关专利。三星电机还与多家其他客户并行开发该技术。
有机桥目标为 5 至 7 层再布线层,线宽与间距 1.5 至 2 微米、过孔 4 至 5 微米,芯片间图案密度达每毫米 500 至 1000 个。三星电机自行试制评估样品,同时评估外部供应,并与三星电子晶圆代工厂合作进行封装评估。
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