ChainCatcher 消息，9 月 15 日，联发科在 2026 年天玑旗舰新品发布会上发布下一代旗舰芯片天玑 9600 Pro。官方介绍，该芯片采用台积电 2nm 制程，晶体管数量超过 330 亿。
芯片采用融合计算架构，将 CPU、GPU、NPU、ISP 等异构计算核心软硬融合，以 AI 为核心引擎。采用全大核架构，配备双超大核 C2-Ultra 4.55GHz、三大核 C2-Pro 4.35GHz 和三大核 C2-Pro 3.1GHz，配备 34.5MB L2+L3+系统缓存，支持 LPDDR6 内存和 UFS 5.0 闪存。对比天玑 9500，超大核功耗下降 37%、多核功耗下降 61%。
GeekBench V6.4 跑分单核 4276 分、多核 12650 分，较天玑 9500 单核提升约 17%、多核约 15%。NPU 采用双 NPU 架构，搭载 APU 1090，峰值性能提升 51%。联发科称连续六年蝉联全球智能手机 SoC 市场份额第一。
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