英特尔CEO:电力与散热已成半导体瓶颈 看好半导体系统级架构趋势

智通财经
5 hours ago
【英特尔CEO:电力与散热已成半导体瓶颈 看好半导体系统级架构趋势】电力与冷却同样是棘手难题。“所有人都清楚电力问题的严峻性。电力至关重要,就像当年核工程师与科学家想方设法获取能源一样,”陈立武称,“想要在部分应用场景下实现低功耗,芯片架构设计与互联技术也变得非常关键。”他继续说道:“另一个重点方向是冷却技术。除风冷外,还有液冷与微流体冷却方案,我们正在对多项相关技术进行投资。” 陈立武建议业界关注半导体市场向系统级架构转型的趋势。他指的是英伟达、AMD将GPU、CPU、网络组件与软件整合到整机机架对外销售的行业潮流。“黄仁勋与苏姿丰正在这么做,”他提到英伟达CEO黄仁勋与AMD首席执行官苏姿丰,“请密切关注我们即将在基板领域发布的消息。”他补充道:“要从整机机架层面着手,处理负载问题,根据客户需求做定制化方案,并与客户协同合作,这一点非常重要。”

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