三星电机与高通据报合作开发有机桥技术

智通财经
Yesterday
【三星电机与高通据报合作开发有机桥技术】9月14日,据报道,三星电机正与高通共同开发用于AI芯片先进封装的“有机桥”技术,双方已开展研发和验证工作超过一年。三星电机还在与其他客户同步开发基于有机桥的2.1D封装基板。据报道,三星电机计划将具有5至7层重新布线层的有机桥嵌入FC-BGA基板,目标将线宽和线距缩小至1.5至2微米。该技术被视为英特尔EMIB硅桥封装技术的潜在替代方案。

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10