地平线(09660.HK):第1,500万颗征程芯片将搭载 HSD V2.1版本即将推出

阿斯达克财经
Sep 16

地平线(09660.HK) 创始人兼CEO余凯表示,第1,500万颗征程芯片将搭载在一汽-大众全新合作车型——ID. AURA T6上。全场景辅助驾驶系统HSD V2.1版本即将推出,首发全场景倒车能力,体验再进一步。余凯还宣布,HSD年内将搭载某龙头新能源大厂车型量产。随着HSD在更多品牌、更多价位段车型上的落地,“智驾平权”正在从理念变为现实。高阶智能驾驶不再是少数豪华品牌的专利,而是愈来愈多...

Source Link

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10