AI拉动覆铜板需求 上市公司加速高端产能布局

证券日报
Sep 14

9月12日,宏昌电子材料股份有限公司(以下简称“宏昌电子”)发布定增预案公告,拟募资不超过18亿元投向高端覆铜板、半固化片及先进封装膜材(GBF)项目,加码AI服务器、数据中心所需的印刷电路板(PCB)核心基材。  根据本次披露的预案,宏昌电子本次募集资金将用于三大项目及补充流动资金。拟投向全资孙公司珠海宏仁电子材料科技有限公司年产1320万张高端覆铜板、3120万米半固化片项目10.55亿元(...

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