时序进入第三季下旬，台积电3nm、2nm先进制程与CoWoS先进封装产能持续供不应求。供应链人士透露，英伟达、苹果等持续占有台积电先进制程与封装资源。此外，亚马逊AWS近期放大AI自研芯片投片，旗下Annapurna取得更多3nm产能。联发科除手机芯片外，也因谷歌TPU相关大单，争抢2/3nm制程与CoWoS-S/L产能。
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