今日,野村证券最新报告指出,半导体(881121)封装基板行业正经历重大结构性变化。2026年7月,封装基板出货额同比增长68%创历史新高,但平均单价环比下降,主因是产品组合从GPU用基板转向服务器CPU用基板,并非需求疲软。台积电(TSM)(TSM.US)在Semicon Taiwan上更新先进封装(886009)路线图,显示基板尺寸和核心层数持续升级,多层核心基板成为技术拐点,集成稳压器预计...
Source Link今日,野村证券最新报告指出,半导体(881121)封装基板行业正经历重大结构性变化。2026年7月,封装基板出货额同比增长68%创历史新高,但平均单价环比下降,主因是产品组合从GPU用基板转向服务器CPU用基板,并非需求疲软。台积电(TSM)(TSM.US)在Semicon Taiwan上更新先进封装(886009)路线图,显示基板尺寸和核心层数持续升级,多层核心基板成为技术拐点,集成稳压器预计...
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