斗山拟投资9700亿韩元扩大AI芯片材料生产

格隆汇
Sep 18
韩国斗山集团计划投资9700亿韩元,扩大AI半导体核心材料“覆铜板(CCL)”的生产。斗山计划首先在韩国投资4200亿韩元,扩建光模块用CCL生产线。该公司计划在目前运营的全北益山金堤、忠北曾坪、庆北金泉工厂中,扩建其中一处的生产线。此外,斗山还将投资5500亿韩元在中国再建一座用于AI加速器和网络交换机的CCL生产工厂。该公司计划从2028年起提高韩国和中国扩建工厂的产量。

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