金吾财讯 | 据外媒报道，美光科技（MU）首席执行官桑杰·梅赫罗特拉在“2026年印度半导体展”上宣布，公司位于印度古吉拉特邦萨南德（Sanand）的半导体封装测试工厂已正式开启商业化生产，并计划于2027年进一步扩大芯片产能，以应对全球AI驱动下快速增长的内存和存储需求。作为印度国家半导体计划首个落地的重大项目，该设施由美光与印度政府共同投资设立，总投资额达27.5亿美元。目前该厂生产的DRAM及NAND成品已贴上“印度制造”标签，并开始向全球客户发货。梅赫罗特拉指出，工厂现阶段产能已超越印度全国笔记本电脑市场的内存需求总量。市场分析认为，随着美光在印度成功实现组装与测试业务的落地，该举措不仅构成了美光全球供应链网络的重要支撑，还与其在美国本土发展先进制造及封装能力的战略形成协同互补。同时，该厂的顺利投产亦标志着印度在推动半导体本土化制造方面迈出了关键一步。
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