媒体援引斗山集团消息报道，斗山计划投入约9700亿韩元，扩大AI芯片所用覆铜板（CCL）的产能。
斗山计划在韩国本土投资4200亿韩元，扩建光模块用覆铜板生产线。
另外将出资5500亿韩元在中国新建一座覆铜板工厂，产品面向AI加速器与网络交换机。
斗山计划从2028年起，提升韩国与中国新增产能的产量。
英伟达自2024年起使用斗山的覆铜板产品；该业务去年销售额同比增长86%，达到1.9万亿韩元。
媒体援引斗山集团消息报道，斗山计划投入约9700亿韩元，扩大AI芯片所用覆铜板（CCL）的产能。
斗山计划在韩国本土投资4200亿韩元，扩建光模块用覆铜板生产线。
另外将出资5500亿韩元在中国新建一座覆铜板工厂，产品面向AI加速器与网络交换机。
斗山计划从2028年起，提升韩国与中国新增产能的产量。
英伟达自2024年起使用斗山的覆铜板产品；该业务去年销售额同比增长86%，达到1.9万亿韩元。
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