大摩:中国先进封装2029年达千亿 设备商优于封测厂

格隆汇
Sep 17
摩根士丹利发布研报称,中国先进封装仍是AI驱动的长期成长赛道,但行业规模增长与封测厂利润增长之间存在分化。封测厂盈利取决于产能能否被填满,设备商收入则取决于产能是否在建,因此偏好设备商多于封测厂,封测环节则优选份额提升者。

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