聚和材料:拟3亿元增资国聚同辉 布局半导体材料领域

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9月17日,聚和材料(688503)(688503.SH)公告称,公司拟以自有资金3.00亿元作为有限合伙人入伙上海国聚同辉企业管理咨询合伙企业(有限合伙)并新增认缴出资,增资完成后持股比例为31.58%,后续公司认缴出资比例预计不超过33.33%。国聚同辉投资方向重点关注半导体材料(884091)相关领域。本次交易已经公司董事会审议通过,关联董事已回避表决,尚需提交公司股东会审议。

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