比亚迪董秘李黔:未来会继续在半导体领域投入和发力

智通财经
4 hours ago
【比亚迪董秘李黔:未来会继续在半导体领域投入和发力】9月16日,比亚迪在比亚迪绍兴赛车场举办高管面对面股东交流会,比亚迪集团董事会秘书、投资处总经理李黔表示,半导体是比亚迪非常重要的能力之一,芯片种类覆盖13大类,567款车规芯片产品,从最早的功率半导体到模拟芯片,再到今年向逻辑芯片的拓展。比亚迪半导体拥有芯片设计、晶圆制造、封装测试全链路设计与制造的能力。未来比亚迪在半导体领域,无论是设计还是生产,都还会持续突破。随着汽车智能化的发展,整车半导体的价值量也会显著提升,因此比亚迪未来还会继续在半导体领域投入和发力。今年推出的璇玑A3芯片是中国首款车规级4nm智驾芯片,目前已开启规模化量产。

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