机构:AI芯片封装突破光罩极限,CoWoS-L稳居先进封装主流至2028年

智通财经
3 hours ago
【机构:AI芯片封装突破光罩极限,CoWoS-L稳居先进封装主流至2028年】根据TrendForce集邦咨询最新半导体先进封装产业研究,随着GPU厂商、超大型云端服务供应商持续开发更强大、功能多元的AI芯片,2.5D封装技术的一项发展重点在于扩大封装面积。其中,TSMCCoWoS-L尽管面临IntelEMIB-T的竞争,但凭借其技术成熟度与良率优势,预计至2028年仍将是AI芯片的主流封装方案。

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10