联发科发布天玑首款PC旗舰SoC:台积电3nm工艺 将搭载于Googlebook

快科技
Sep 22

快科技9月22日消息,联发科宣布推出全新天玑个人计算系列平台的首款旗舰SoC——Dimensity CX C10 Max。新款芯片将搭载于谷歌即将上市的Googlebook。

据介绍,天玑CX C10 Max采用台积电(TSMC)3nm工艺制造;CPU部分为“1+3+4”三丛架构,由1个Cortex-X925内核、3个Cortex-X4内核以及4个Cortex-A720内核组成,拥有12MB的L3缓存和10MB的SLC缓存。

GPU部分为11个核心的Immortalis-G925;搭配NPU 890,提供最高55TOPS的AI算力,专门针对Gemini Intelligence功能做了优化,响应速度更快,且拥有更完善的隐私保护。

同时支持LPDDR5X-9600内存和UFS 4.0闪存;提供3条PCIe 4.0通道;支持1个全功能USB 5Gbps;最多3路4K视频输出;Imagiq 1090 ISP支持32MP摄像头,提供高品质HDR视频拍摄;支持7.3Gbps的Wi-Fi 7连接,还有蓝牙6.0。

联发科表示,天玑CX C10 Max通过高性能平台架构,在多任务处理、生产力应用、智能辅助和娱乐等多元应用场景中提供优异性能,结合节能架构,可协助制造商打造更轻薄、无风扇且具备全天续航能力的设备。

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