【国金证券:机构看好三条PCB设备行业核心受益环节】国金证券研报表示,AI算力建设驱动高端PCB扩产,同时高多层化、高阶HDI化、材料低损耗化与线路精细化四大趋势推动设备升级,二者叠加,PCB设备行业进入景气上行与结构升级并行的阶段。机构看好三条核心受益环节:一是超快激光钻孔,材料升级打开需求,产业化迈入0-1阶段;二是层压机,高多层、材料升级与mSAP三重共振,扩产需求加速释放;三是曝光设备,线路精细化推动直写成像升级,进入产业爆发前刻。随着AI高端板扩产持续与工艺技术升级,超快激光、层压机与曝光设备的市场空间广阔,建议重点关注在核心环节具备技术卡位与量产能力的龙头厂商。
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