中国杭州2026年9月22日 /美通社/ -- 9月22日,3M以"扩束光学,拓界芯联"为主题,亮相2026 APSAPA云栖大会4号馆(产业馆,展位号4-C18),重点展示面向AI数据中心场景的3M EBO扩束光互连解决方案,以及粘接、导热、遮蔽等功能性材料创新应用,与行业伙伴共同探索高性能数据中心基础设施的未来发展方向。 随着人工智能应用快速发展,数据中心对高速率、高密度、可靠互连的需求...
Source Link中国杭州2026年9月22日 /美通社/ -- 9月22日,3M以"扩束光学,拓界芯联"为主题,亮相2026 APSAPA云栖大会4号馆(产业馆,展位号4-C18),重点展示面向AI数据中心场景的3M EBO扩束光互连解决方案,以及粘接、导热、遮蔽等功能性材料创新应用,与行业伙伴共同探索高性能数据中心基础设施的未来发展方向。 随着人工智能应用快速发展,数据中心对高速率、高密度、可靠互连的需求...
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