Taiwan Breaks Ground at Kaohsiung Industrial Park, Taiwan, With TSMC to Establish Packaging Hub
MT Newswires Live
Sep 21
Taiwan on Monday began work on the new advanced packaging industrial park with the groundbreaking ceremony of Baipu Industrial Park, in Kaohsiung, Taiwan, where chipmaker Taiwan Semiconductor Manufacturing Co (TPE:2330) also plans to establish facilities, according to a same-day official statement.
TSMC plans to develop a three-hectare site featuring two buildings with modular facilities including a technology validation laboratory and a talent training centre.
The facilities are expected to begin operations in the fourth quarter of 2029, local media reports, quoting Kaohsiung Deputy Mayor Lo Ta-sheng as saying at the groundbreaking ceremony.
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