【理想汽车首次回应卖技术】针对近日理想汽车准备对外供应马赫芯片、碳化硅模组等自研技术产品的消息，理想汽车马东辉今日在媒体沟通会上表示，芯片、碳化硅模组可以对外输出。这类芯片体积较小，其他厂商可以完成适配，通用性较强。但理想自研的PACK包无法对外输出，PACK包是根据理想自身的整车需求、车型特点定制开发，产能规划也匹配理想整车产能。“理想自研的部分部件能够形成标准化产品的，可以对外销售。”他称。
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