消息称三星HBM4产能明年或翻倍

智通财经
Sep 21
【消息称三星HBM4产能明年或翻倍】业界消息指出,三星计划将HBM制程中玻璃载体的外包清洗量由今年每月2万片提升至明年每月5万片,较去年每月1万片增至5倍。玻璃载体是HBM制程中临时安装于DRAM晶圆底部的支撑结构,用于防止晶圆在蚀刻与钻孔过程中发生弯曲或破裂。由于玻璃载体可重复使用,实际用量受投料方式及制程良率影响,但若清洗需求增至2.5倍,预示三星HBM4系列明年产量至少翻倍的可能性较高。三星正积极筹备扩大HBM4与HBM4E产能,两款产品均采用12层以上的高堆叠架构。

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10